UTStarcom Shares Insights on the Future of Optical Interconnects for AI Data Centers at the 7th China Electronics and Communications Equipment Developers Summit 2026
SHANGHAI, China, August 27, 2026 — On August 25–26, 2026, the 7th China Electronics and Communications Equipment Developers Summit was held in Shanghai.
The 7th China Electronics and Communications Equipment Developers Summit concurrently hosted the 2026 6G & Satellite Communications Technology Forum and the 2nd Data Center Optoelectronic High-Speed Interconnect Technology Forum. The event brought together over 40 keynote speakers and more than 300 industry experts from across the industry value chain.
The conference focused on pivotal technical topics including data center optical interconnects, Co-Packaged Optics (CPO), thermal management for optical transceivers, satellite communication payloads, inter-satellite laser links, and advanced optical communication materials. Attendees engaged in deep discussions exploring the evolution of communication technologies in the AI era and across integrated space-air-ground networks.
Mr. Feng Haiming, Senior Product Manager at UTStarcom Telecom Co., Ltd., was invited to deliver a keynote speech titled “Building Optical Interconnect Architectures for AI Data Centers: Exploring Optical Circuit Switching (OCS) Opportunities and Challenges.”
Addressing the unprecedented computing demands of large AI model training, Mr. Feng analyzed the key bottlenecks faced by AI data centers in bandwidth, latency, and energy efficiency. Drawing on UTStarcom’s extensive expertise in optical transport, Software Defined Networking (SDN), and Optical Circuit Switching (OCS), he introduced a reconfigurable optical-electrical collaborative architecture that enables the evolution from traditional “interconnection” toward deeper “integration.” He also outlined the role of OCS technology in addressing challenges in ultra-large-scale intelligent computing environments and highlighted the key hurdles to large-scale deployment.
The presentation generated strong interest among attendees. After the keynote, industry experts, scholars, and ecosystem partners engaged in in-depth discussions with Mr. Feng on OCS integration with AI clusters and future optical interconnect standards, with several companies expressing interest in further collaboration.
UTStarcom remains committed to advancing core optical interconnect technologies and working alongside industry partners to accelerate the innovation and deployment of next-generation AI networking infrastructure.
For inquiries regarding our OCS solution, please contact us at sales@utstar.com